Chips Joint Undertaking

The Chips Joint Undertaking will reinforce the European semiconductor ecosystem and Europe’s technological leadership. It will bridge the gap between research, innovation and production thereby facilitating the commercialisation of innovative ideas.

The Chips JU will, among others, deploy pilot lines for which the Commission announced today the first call with €1.67 billion of EU funding.

Total budget: €1.67 billion (available in first calls)

Funding rate: funding rate of EU and national co-funding varies between 25-90% of the project related costs

Eligibility: Horizon Europe Associated states

First calls for funding Chips pilot lines

To launch its first calls for innovative pilot lines, the Chips JU will make €1.67 billion in EU funding available. The calls are open to organisations that wish to establish pilot lines in Member States, typically research and technology organisations, calling for proposals on:

  • Fully Depleted Silicon on Insulator, towards 7 nm: This transistor architecture is a European innovation and has distinct advantages for high-speed and energy-efficient applications. A roadmap towards 7 nm will provide a path towards the next generation of high-performance, low-power semiconductor devices.
  • Leading-edge nodes below 2 nm: This pilot line will focus on developing cutting-edge technology for advanced semiconductors at the size of 2 nanometres and below, which will play essential roles in a variety of applications, from computing to communication devices, transport systems and critical infrastructure.
  • Heterogeneous system integration and assembly: Heterogeneous integration is an increasingly attractive technology for innovation and increased performance. It refers to the use of advanced packaging technologies and novel techniques to combine semiconductor materials, circuits or components into one compact system.
  • Wide Bandgap semiconductors: The focus will be on materials that allow electronic devices to operate at much higher voltage, frequency and temperature than standard silicon-based devices. Wide bandgap and ultra-wide bandgap semiconductors are necessary to develop highly efficient power, lighter weight, lower costs and radio-frequency electronics.

Open Calls

Call 1 IA and Call 2 RIA are calls in 2 phases:

  • You can submit your Project Outline (PO) until 14 May 2024, 17:00 at the latest.
  • After this, you must submit your Full Project Proposal (FPP) no later than 17 September 2024, 17:00.

Call 3 is a call with 1 phase:

  • You only submit your Full Project Proposal (FPP). This is possible until 14 May 2024, 17:00.

HORIZON-JU-Chips 2024-1-IA T1

Global call according to SRIA 2024 (IA)

TRL* 5 – 8

Budget: €103 million

Visit call page

HORIZON-JU-Chips 2024-1-IA T2

Focus topic on ‘High Performance RISC-V Automotive Processors supporting SDV’

TRL 5 – 6

€20 million

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HORIZON-JU-Chips 2024-1-IA T3

Focus topic on ‘Service Oriented Framework for the Software Defined Vehicle of the future’

TRL 5 – 6

€20 million

Visit call page

HORIZON-JU-Chips 2024-2-RIA-T1

Global call according to SRIA 2023 (RIA)

TRL 3 – 4

€52 million

Visit call page

HORIZON-JU-Chips 2024-2-RIA T2

Focus topic on ‘Sustainable and greener manufacturing’

TRL 5 – 8

€15 million

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HORIZON-JU-Chips 2024-3-RIA

Joint call with Korea on Heterogeneous integration and neuromorphic computing technologies for future

TRL 2 – 4

€6 million

Visit call page


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